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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/07/2024
Application #:
18178901
Filing Dt:
03/06/2023
Publication #:
Pub Dt:
11/16/2023
Inventors:
Hefu PU, Ming MIN, Yu MIAO, Junjie ZHENG, Xiaojun WEN
Title:
DESIGN METHOD OF SOIL COVER LAYER OF SOLID WASTE LANDFILL CONSIDERING EFFECT OF PLANT ROOT
Assignment: 1
Reel/Frame:
062893/0110Recorded: 03/06/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/10/2023
Exec Dt:
02/10/2023
Exec Dt:
02/10/2023
Exec Dt:
02/10/2023
Exec Dt:
02/10/2023
Assignee:
NO. 1037 LUOYU ROAD, HONGSHAN DISTRICT
WUHAN, HUBEI PROVINCE, CHINA
Correspondent:
NITIN KAUSHIK
50 LERER LANE
STATEN ISLAND, NY 10307

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