Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
05/07/2024
|
Application #:
|
17455719
|
Filing Dt:
|
11/19/2021
|
Publication #:
|
|
Pub Dt:
|
03/10/2022
| | | | |
Inventors:
|
Yoshio TSUKIYAMA, Teppei YAMAGUCHI, Akiyoshi OSAKADA
|
Title:
|
PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2701-1, AZA IWAKURA, OMINECHO-HIGASHIBUN |
MINE-SHI, YAMAGUCHI-PREFECTURE, JAPAN 759-2212 |
|
|
2-56, SUDA-CHO, MIZUHO-KU |
NAGOYA-SHI, AICHI-PREFECTURE, JAPAN 467-8530 |
|
|
|
STEPHEN P. BURR |
BURR & BROWN, PLLC |
P.O. BOX 869 |
FAYETTEVILLE, NY 13066 |
|
|
Search Results as of:
05/30/2024 07:58 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|