Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17016379
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Filing Dt:
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09/10/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Akira HORIKOSHI, Shigeru TAKATSUJI, Takahiro KIMURA, Shohei NAKAMURA, Motohiro KONO et al
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Title:
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI, |
KYOTO, JAPAN 602-8585 |
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JCIPRNET |
8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
TAIPEI, 100404 TAIWAN |
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09/22/2024 05:46 PM
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