Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17395496
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Filing Dt:
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08/06/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Chih-Wei PENG, Chih-Chung HSU, Chih-Chung WU, Zuon-Min CHUANG
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Title:
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PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, INDUSTRY EAST 4 RD. |
| SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 30077 |
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| OCP ASIA, INC. |
| NO. 26, INDUSTRY EAST 4 RD. |
| SCIENCE BASED INDUSTRIAL PARK, |
| HSINCHU, 30077 TAIWAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2222 WELLINGTON COURT |
| LISLE, ILLINOIS 60532 |
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| MOLEX, LLC |
| 2222 WELLINGTON COURT |
| LISLE, IL 60532 |
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09/23/2024 10:47 AM
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