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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/21/2024
Application #:
17213241
Filing Dt:
03/26/2021
Publication #:
Pub Dt:
09/29/2022
Inventors:
Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh et al
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
055775/0771Recorded: 03/31/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2020
Exec Dt:
06/12/2020
Exec Dt:
06/12/2020
Exec Dt:
06/12/2020
Exec Dt:
06/12/2020
Exec Dt:
06/17/2020
Exec Dt:
06/12/2020
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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