Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17720211
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Filing Dt:
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04/13/2022
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Publication #:
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Pub Dt:
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07/28/2022
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Inventors:
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Tae Ki Kim, Jae Beom Shim, Seung Nam Son, Won Chul Do
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Title:
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DEVICE CHIP SCALE PACKAGE INCLUDING A PROTECTIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100, AMKOR-RO, BUK-GU |
| GWANGJU, KOREA, REPUBLIC OF 61006 |
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| SPECTRUM IP LAW GROUP LLC |
| 558 E CASTLE PINES PKWY, STE B4-362 |
| B4-362 |
| CASTLE PINES, CO 80108-4608 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD, VALLEY POINT #12-03 |
| VALLEY POINT #12-03 |
| SINGAPORE, SINGAPORE 248373 |
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| SPECTRUM IP LAW GROUP LLC |
| 558 E CASTLE PINES PKWY, STE B4-362 |
| B4-362 |
| CASTLE PINES, CO 80108-4608 |
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06/18/2024 05:32 PM
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