Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2024
|
Application #:
|
17343992
|
Filing Dt:
|
06/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2022
| | | | |
|
Inventors:
|
Changeun JOO, Jaeean LEE, Gyujin CHOI
|
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
|
|
| LEE IP LAW P.C. |
| 3141 FAIRVIEW PARK DRIVE SUITE 500 |
| SUITE 500 |
| FALLS CHURCH, VA 22042 |
|
|
Search Results as of:
11/12/2024 01:21 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
