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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11991823	Issue Dt:	05/21/2024	Application #:	17333972	Filing Dt:	05/28/2021
Publication #:	20210385947	Pub Dt:	12/09/2021
Inventors:	CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI, I-JU WU, CHI-HO TIEN
Title:	CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

Assignment: 1

Reel/Frame:

056386/0380

Recorded: 05/28/2021

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LIN, CHIH-YI

Exec Dt:

03/31/2021

CHENG, KUO-KUANG

Exec Dt:

03/31/2021

CHIANG, CHI-CHIN

Exec Dt:

03/31/2021

TAI, WEN-HSIN

Exec Dt:

03/31/2021

WU, I-JU

Exec Dt:

03/31/2021

TIEN, CHI-HO

Exec Dt:

03/31/2021

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK

HSINCHU, SINGAPORE

Correspondent:

WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS

1100 QUAIL STREET, SUITE 202

NEWPORT BEACH, CA 92660

Assignment: 2

Reel/Frame:

056498/0492

Recorded: 06/02/2021

Pages: 5

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME AND ADDRESS ON THE COVER SHEET PREVIOUSLY RECORDED AT REEL: 056386 FRAME: 0380. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

LIN, CHIH-YI

Exec Dt:

03/31/2021