Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/28/2024
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Application #:
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17616673
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Filing Dt:
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12/05/2021
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Publication #:
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Pub Dt:
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10/20/2022
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Inventors:
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Shigeo Sakata, Takahiro Kajinishi, Seiichiro Kihara, Hiroshi Takahara
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Title:
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Semiconductor Component Test Device and Method of Testing Semiconductor Components
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 230 SANBOCHO, 4-CHOME |
| SAKAI-KU, SAKAI-SHI |
| OSAKA-FU, JAPAN 590-0906 |
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| J-PAT U.S. PATENT LEGAL SERVICES |
| OOE BUILDING, NO. 508 |
| 8-1 NISHITEMMA 2-CHOME, KITA-KU |
| OSAKA-SHI, 530-0047 JAPAN |
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