Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/02/2024
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Application #:
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17575038
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Filing Dt:
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01/13/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Inventors:
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Kok Yau CHUA, Josef HOEGLAUER, Chiah Chin LIM, Mei Qi TAY, Angela KESSLER
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Title:
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PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELATED STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| DICKE, BILLIG & CZAJA, PLLC |
| 100 SOUTH FIFTH STREET |
| SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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11/11/2024 02:32 PM
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