Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/23/2024
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Application #:
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17574565
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Filing Dt:
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01/13/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Shang-Chi Wang, Miao-Pei Chen, Han-Zong Wu, Chia-Chi Tsai, I-Ching Li
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Title:
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WAFER SURFACE DEFECT INSPECTION METHOD AND APPARATUS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, INDUSTRIAL EAST ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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