Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/06/2024
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Application #:
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17605493
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Filing Dt:
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10/21/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Inventors:
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Benjamin K. Yaffe, Bo Lu
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Title:
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Connectors For High Density Neural Interfaces
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 269 EAST GRAND AVE. |
| SOUTH SAN FRANCISCO, CALIFORNIA 94080 |
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| KILPATRICK TOWNSEND & STOCKTON |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111 |
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Assignment:
2
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| 2999 OLYMPUS BLVD |
| SUITE 1000/10TH FLOOR |
| DALLAS, TEXAS 75019 |
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| HUI CHIN SMITH |
| 1100 PEACHTREE STREET NE |
| SUITE 2800 |
| ATLANTA, GA 30309 |
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