Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/03/2024
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Application #:
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18544100
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Filing Dt:
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12/18/2023
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Inventors:
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Kai-Fang Cheng, Hsiao-Kang Chang, Ming-Han Lee
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Title:
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INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP |
| 2801 N. HARWOOD ST. |
| SUITE 2300 |
| DALLAS, TX 75201 |
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