Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/15/2024
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Application #:
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17288618
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Filing Dt:
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04/26/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Binti Haridan FATIN FARHANAH, Takayuki YOGO, Hiroyuki ABE
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Title:
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Chip Package Positioning and Fixing Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2520, TAKABA |
| HITACHINAKA-SHI, IBARAKI, JAPAN |
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| CROWELL & MORING LLP |
| P.O. BOX 14300 |
| WASHINGTON, DC 20044-4300 |
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06/30/2025 02:48 PM
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