Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/22/2024
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Application #:
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18360066
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Filing Dt:
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07/27/2023
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Publication #:
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Pub Dt:
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11/16/2023
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Inventors:
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Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai et al
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Title:
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INTEGRATED CHIP WITH INTER-WIRE CAVITIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK |
| 195 S. MAIN ST., SUITE 400 |
| AKRON, OH 44308 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 8TH INVENTOR NOT ADDED ON ORIGINAL FILING PREVIOUSLY RECORDED ON REEL 064401 FRAME 0515. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK |
| 195 S. MAIN ST., SUITE 400 |
| AKRON, OH 44308 |
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06/22/2025 04:48 PM
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