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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/11/2025
Application #:
17458653
Filing Dt:
08/27/2021
Publication #:
Pub Dt:
03/02/2023
Inventors:
TIANGE XIE, LI XIANG ZHENG, ALEX CHIN SERN TING, ZHENZHEN HE
Title:
LASER-CUT LEAD-FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES
Assignment: 1
Reel/Frame:
057329/0565Recorded: 08/30/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/25/2021
Exec Dt:
08/25/2021
Exec Dt:
08/25/2021
Exec Dt:
08/25/2021
Assignee:
12500 TI BOULEVARD
M/S 3999
DALLAS, TEXAS 75243
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474
M/S 3999
DALLAS, OH 75265

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