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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
12401366
Issue Dt:
08/26/2025
Application #:
18286656
Filing Dt:
10/12/2023
Publication #:
20240195422
Pub Dt:
06/13/2024
Inventors:
Hiroki SATO, Masayuki SATO, Takaaki SHIRAKAWA, Chunhui PAN, Noboru ISHIHARA et al
Title:
SENSOR INTERFACE CIRCUIT AND SENSOR MODULE
Assignment: 1
Reel/Frame:
065200/0299Recorded: 10/12/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SATO, HIROKI
Exec Dt:
09/14/2023
SATO, MASAYUKI
Exec Dt:
09/14/2023
SHIRAKAWA, TAKAAKI
Exec Dt:
09/19/2023
PAN, CHUNHUI
Exec Dt:
09/29/2023
ISHIHARA, NOBORU
Exec Dt:
09/13/2023
MURATA, SHINJI
Exec Dt:
09/12/2023
Assignees:
NISSHINBO MICRO DEVICES INC.
3-10, NIHONBASHI YOKOYAMA-CHO, CHUO-KU
TOKYO, JAPAN 103-8456
TOKYO INSTITUTE OF TECHNOLOGY
12-1, OOKAYAMA 2-CHOME, MEGURO-KU
TOKYO, JAPAN 152-8550
ALPS ALPINE CO., LTD.
1-7, YUKIGAYA-OTSUKAMACHI, OTA-KU
TOKYO, JAPAN 145-8501
Correspondent:
EE MING T. BAHK
OLIFF PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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