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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/14/1981
Application #:
05957094
Filing Dt:
11/03/1978
Inventors:
*** EXPO DATA IS NOT AVAILABLE FOR THIS RECORD ***
Title:
MICROCIRCUIT PACKAGE FORMED OF MULTI-COMPONENTS
Assignment: 1
Reel/Frame:
005150/0161Recorded: 09/29/1989Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
05/26/1989
Assignee:
Correspondent:
BARRY R. LIPSITZ
55 SWEETBRIAR TRAIL
EASTON, CT 06612
Assignment: 2
Reel/Frame:
005240/0568Recorded: 07/27/1989Pages: 16
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/26/1989
Exec Dt:
05/26/1989
Assignee:
7 NEW ENGLAND EXECUTIVE PARK
A MASSACHUSETTS TRUST CO.
BURLINGTON, MASSACHUSETTS 01803
Correspondent:
FINE & AMBROGNE
EXCHANGE PLACE
BOSTON, MA 02109

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