Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/31/1983
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Application #:
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06336109
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Filing Dt:
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12/30/1981
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Inventors:
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SHAO-FU CHU, ALLEN PANG-I HO, CHENG T. HORNG, BERNARD M. KEMLAGE
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Title:
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METHOD OF FORMING WIDE, DEEP DIELECTRIC FILLED ISOLATION TRENCHES IN THE SURFACE OF A SILICON SEMICONDUCTOR SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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M. S. BIGEL |
IBM CORP., PAT. OPERS. |
1755 S. JEFF. DAVIS HWY., RM. 605 |
ARLINGTON, VA 22202 |
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