Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/03/1984
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Application #:
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06288857
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Filing Dt:
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07/31/1981
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Inventors:
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SRINIVAS T. RAO, JEOFFREY MOTT
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Title:
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BONDING PAD METALLIZATION FOR SEMICONDUCTOR DEVICES
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Assignment:
1
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LICENSE (SEE DOCUMENT FOR DETAILS).
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| EXXON RESEARCH & ENGINEERING CO. |
| P. O. BOX 390 |
| FLORHAM PARK, N. J. 07932 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| MR. ARTHUR L. PLEVY |
| 146 ROUTE 1 NORTH |
| EDISON, NEW JERSEY 08817 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| MCDONNELL DOUGLAS CORPORATION |
| 3855 LAKEWOOD BLVD. |
| LONG BEACH, CA 90846 |
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