Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/18/1984
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Application #:
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06423283
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Filing Dt:
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09/24/1982
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Inventors:
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HIDEHARU EGAWA, KATSUYA OKUMURA
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Title:
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BONDING WIRE, SEMICONDUCTOR DEVICE HAVING THE SAME, AND BONDING METHOD USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 72 HORIKAWA-CHO, SAIWAI-KU, |
| KAWASAKI-SHI,, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & |
| DUNNER |
| 1775 K ST., N. W. |
| WASHINGTON, DC 20006 |
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