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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/16/1986
Application #:
06625386
Filing Dt:
06/28/1984
Inventors:
ERNEST N. LEVINE, LEWIS D. LIPSCHUTZ, HORATIO QUINONES
Title:
PROCESS FOR FORMING IMPROVED SOLDER CONNECTIONS FOR SEMICONDUCTOR DEVICES WITH ENHANCED FATIGUE LIFE
Assignment: 1
Reel/Frame:
004280/0306Recorded: 06/28/1984Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
06/27/1984
Exec Dt:
06/27/1984
Exec Dt:
06/27/1984
Assignee:
A NY CORP.
ARMONK, NEW YORK 10504
Correspondent:
WOLMAR J. STOFFEL
IBM CORP. DEPT., 901 BLDG. 300/482
HOPEWELL JUNCTION, NY 12533-9988

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