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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/09/1986
Application #:
06736205
Filing Dt:
05/20/1985
Inventors:
KENNETH R. SMITH, KENT H. JOHNSTON, GEORGE S. LA RUE, ROBERT A. MUELLER et al
Title:
METHOD OF PACKAGING INTEGRATED CIRCUIT CHIPS, AND INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
004590/0241Recorded: 08/11/1986Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
05/14/1985
Exec Dt:
05/13/1985
Exec Dt:
05/20/1985
Exec Dt:
05/13/1985
Exec Dt:
05/16/1985
Assignee:
4900 S.W. GRIFFITH DRIVE
P.O. BOX 500
BEAVERTON, OREGON 97077
Correspondent:
JOHN D. WINKELMAN
TEKTRONIX, INC., P. O. BOX 500
DELIVERY STATION Y3-121
BEAVERTON, OR 97077
Assignment: 2
Reel/Frame:
007562/0805Recorded: 08/07/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/27/1995
Assignee:
120 SAN GABRIEL DRIVE
SUNNYVALE, CALIFORNIA 94086
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
ROGER W. BLAKELY, JR.
12400 WILSHIRE BOULEVARD
SEVENTH FLOOR
LOS ANGELES, CA 90025

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