Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/12/1988
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Application #:
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06940328
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Filing Dt:
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12/11/1986
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Inventor:
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EIICHI IRIE
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Title:
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CONTROL APPARATUS FOR REDUCING ADHESIVE FORCE OF ADHESIVE AGENT ADHERING BETWEEN SEMICONDUCTOR WAFER AND SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| NO. 23-23, HON-CHO, ITABASHI-KU |
| TOKYO, JAPAN |
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| ARMSTRONG, NIKAIDO, MARMELSTEIN & |
| KUBOVCIK |
| 1725 K ST., N. W., STE. 912 |
| WASHINGTON, DC 20006 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 23-23 HON-CHO, ITABASHI-KU |
| TOKYO, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI, ET AL. |
| LE-NHUNG MCLELAND |
| SUITE 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, D.C. 20006 |
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