Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/12/1988
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Application #:
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07002582
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Filing Dt:
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01/12/1987
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Inventors:
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DEREJE AGONAFER, RICHARD CHAO-FAN CHU, ROBERT E. SIMONS
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Title:
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CIRCUIT PACKAGE COOLING TECHNIQUE WITH LIQUID FILM SPREADING DOWNWARD ACROSS PACKAGE SURFACE WITHOUT SEPARATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| A CORP. OF NY. |
| ARMONK, NEW YORK 10504 |
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| W.S. ROBERTSON |
| IBM CORP., DEPT. 447/BLDG. 414 |
| P.O. BOX 950 |
| POUGHKEEPSIE, NY 12602 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 6835 CARDINAL COVE |
| MOUND, MINNESOTA 55364 |
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| RICHARD O. BARTZ |
| BURD, BARTZ & GUTENKAUF |
| 1300 FOSHAY TOWER |
| MINNEAPOLIS, MN 55402 |
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