Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/22/1988
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Application #:
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07017419
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Filing Dt:
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02/24/1987
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Inventors:
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KUNIO SAKUMA, SADASUMI UCHIYAMA
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Title:
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CIRCUIT SUBSTRATE AND METHOD FOR FORMING BUMPS ON THE CIRCUIT SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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4-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
TOKYO-TO, JAPAN |
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BLUM KAPLAN |
1120 AVE., OF THE AMERICAS |
NEW YORK, NY 10036 |
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