Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/23/1989
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Application #:
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07068646
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Filing Dt:
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06/30/1987
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Inventor:
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HELMUT EHLER
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Title:
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METHOD AND ARRANGEMENT FOR REFLOW SOLDERING AND REFLOW UNSOLDERING OF CIRCUIT BOARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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THEODOR-STERN-KAI 1 |
D-6000 FRANKFURT AM MAIN 70 WEST, GERMANY |
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MCGLEW AND TUTTLE |
28 WEST 44TH STREET |
NEW YORK, NY 10036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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SEDANSTRABE 10 |
ULM (DONAU), GERMANY D-7900 |
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MCGLEW AND TUTTLE, P.C. |
SCARBOROUGH STATION |
SCARBOROUGH, NY 10510-0827 |
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