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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/29/1989
Application #:
07175784
Filing Dt:
03/31/1988
Inventors:
DENNIS J. HERRELL, DAVID A. GIBSON
Title:
METHOD OF ASSEMBLING A FLUID-COOLED INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
015370/0654Recorded: 11/18/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/19/1986
Exec Dt:
03/19/1986
Assignee:
2535 BROCKTON DRIVE, SUITE 500
AUSTIN, TEXAS 78758
Correspondent:
STERNE KESSLER GOLDSTEIN & FOX PLLC
1100 NEW YORK AVENUE NW
WASHINGTON, DC 20005-3934
Assignment: 2
Reel/Frame:
015370/0651Recorded: 11/18/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/1987
Exec Dt:
09/25/1987
Assignee:
2535 BROCKTON DRIVE, SUITE 500
AUSTIN, TEXAS 78758
Correspondent:
STERNE KESSLER GOLDSTEIN & FOX PLLC
1100 NEW YORK AVENUE NW
WASHINGTON, DC 20005-3934
Assignment: 3
Reel/Frame:
014892/0165Recorded: 07/23/2004Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/28/2004
Assignee:
171 MAIN STREET, #271
LOS ALTOS, CALIFORNIA 94022
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
EVAN R. SMITH
1100 NEW YORK AVENUE, N.W.
WASHINGTON, D.C. 20005-3934

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