Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/31/1989
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Application #:
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07196389
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Filing Dt:
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05/20/1988
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Inventors:
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NOBORU HIRAKAWA, YASUKAZU INOUE
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Title:
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SEMICONDUCTOR DEVICE HAVING WIRING LAYER COMPOSED OF SILICON FILM AND ALUMINUM FILM WITH IMPROVED CONTACT STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 33-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| HELFGOTT AND KARAS |
| SUITE 2900 |
| 60TH FLOOR |
| 420 LEXINGTON AVENUE |
| NEW YORK, N.Y. 10170 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 EAST 52ND STREET, 19TH FLOOR |
| MANHATTAN TOWER |
| NEW YORK, NEW YORK 10033 |
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| BRYAN H. DAVIDSON |
| NIXON & VANDERHYE P.C. |
| 901 NORTH GLEBE ROAD |
| 11TH FLOOR |
| ARLINGTON, VA 22203 |
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