Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/1989
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Application #:
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07184775
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Filing Dt:
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04/22/1988
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Inventors:
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FUMIO MIYAGAWA, HIROYUKI SAKAI, TOSHIKAZU TAKENOUCHI
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Title:
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PACKAGE FOR MOUNTING A SEMICONDUCTOR CHIP OF ULTRA-HIGH FREQUENCY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 711, AZA SHARIDEN |
| OAZA KURITA, NAGANO-SHI, NAGANO, JAPAN |
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| STAAS & HALSEY |
| 1825 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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