Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/26/1990
|
Application #:
|
07226161
|
Filing Dt:
|
07/29/1988
|
|
Inventors:
|
HARRY R. BICKFORD, RAYMOND R. HORTON, ISMAIL C. NOYAN, MICHAEL J. PALMER, JOHN C. ZYZO
|
|
Title:
|
METHOD AND APPARATUS FOR FLUXLESS SOLDER BONDING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST.
|
|
|
|
|
|
|
|
|
|
| DANIEL P. MORRIS |
| INTELLECTUAL PROPERTY LAW DEPT. |
| IBM CORP. |
| P. O. BOX 218 |
| YORKTOWN HGTS., NY 10598 |
|
|
Search Results as of:
09/02/2025 03:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
