Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/1991
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Application #:
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07557672
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Filing Dt:
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07/24/1990
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Inventor:
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TRUNG T. DOAN
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Title:
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METHOD OF ETCHING BACK OF TUNGSTEN LAYERS ON SEMICONDUCTOR WAFERS, AND SOLUTION THEREFORE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 2805 E. COLUMBIA RD. |
| A CORP. OF DE |
| BOISE, IDAHO 83706 |
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| WELLS, ST. JOHN & ROBERTS |
| W. 601 MAIN AVENUE, STE. 815 |
| SPOKANE, WA 99201-0679 |
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