Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/1991
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Application #:
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07465861
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Filing Dt:
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01/16/1990
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Inventors:
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YONENORI HAMADA, EIJI SENBOKUYA
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Title:
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BIMETALLIC CIRCUIT BREAKER WITH INSULATED THERMAL ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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NO. 1760, HIGASHIMATANO-CHO, TOTSUKA-KU |
YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN |
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NO. 41, HIGASHIMATANO-CHO, TOTSUKA-KU |
YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN |
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SUGHRUE, MION, ZINN, |
MACPEAK & SEAS |
2100 PENNSYLVANIA AVENUE, N.W. |
WASHINGTON, D.C. 20237-3202 |
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