Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/1991
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Application #:
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07371348
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Filing Dt:
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06/26/1989
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Inventor:
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SHOSAKU SASAKI
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Title:
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HOT-BONDING SILICONE ADHESIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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3-16, 2-CHOME, NIHONBASHI-MUROMACHI, CHUO-KU |
TOKYO, JAPAN |
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DOW CORNING CORPORATION |
PATENT DEPARTMENT-MAIL 1232 |
MIDLAND, MI 48686-0994 |
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