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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/08/1991
Application #:
07477404
Filing Dt:
02/09/1990
Inventors:
NOBUTAKA SHIMIZU, TAKEHISA TSUJIMURA, MASAHIRO SUGIMOTO, SHIGEKI HARADA
Title:
CERAMIC PACKAGE TYPE SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING THE SAME
Assignment: 1
Reel/Frame:
005229/0689Recorded: 02/09/1990Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
02/01/1990
Exec Dt:
02/01/1990
Exec Dt:
02/01/1990
Exec Dt:
02/01/1990
Assignee:
1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA 211, JAPAN
Correspondent:
ARMSTRONG, NIKAIDO, MARMELSTEIN &
KUBOVCIK
1725 K ST. N.W.
STE. 1000
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
021976/0876Recorded: 12/05/2008Pages: 30
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/04/2008
Assignee:
7-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN 163-0722
Correspondent:
KRATZ, QUINTOS & HANSON, LLP
1420 K STREET, N.W.
SUITE 400
WASHINGTON, DC 20005

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