Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/05/1991
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Application #:
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07592750
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Filing Dt:
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10/04/1990
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Inventors:
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BERNARD D. GELLER, JOHANN U. TYLER, GEORGE F. LAIRD III, LOUIS B. HOLDEMAN et al
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Title:
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METHOD OF PACKAGING MICROWAVE SEMICONDUCTOR COMPONENTS AND INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 950 L'ENFANT PLAZA, S.W., |
| WASHINGTON, DISTRICT OF COLUMBIA 20024 |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6560 ROCK SPRING DRIVE |
| BETHESDA, MARYLAND 20817 |
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| J. FRANK OSHA |
| SUGHRUE MION ZINN MACPEAK & SEAS |
| 2100 PENNSYLVANIA AVENUE, N.W., STE. 800 |
| WASHINGTON, D.C. 20037-3202 |
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Assignment:
3
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GRANT OF SECURITY INTEREST
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| 60 WALL STREET |
| NEW YORK, NEW YORK 10005 |
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| WHITE & CASE LLP |
| JOHN M. GENOVA |
| PATENT DEPARTMENT |
| 1155 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036 |
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Assignment:
4
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| 11 MADISON AVENUE |
| NEW YORK, NEW YORK 10010 |
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| CORPORATION SERVICE COMPANY |
| 1090 VERMONT AVENUE NW, SUITE 430 |
| ATTN: JEAN PATERSON |
| WASHINGTON, DC 20005 |
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