Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/05/1991
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Application #:
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07592750
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Filing Dt:
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10/04/1990
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Inventors:
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BERNARD D. GELLER, JOHANN U. TYLER, GEORGE F. LAIRD III, LOUIS B. HOLDEMAN et al
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Title:
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METHOD OF PACKAGING MICROWAVE SEMICONDUCTOR COMPONENTS AND INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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950 L'ENFANT PLAZA, S.W., |
WASHINGTON, DISTRICT OF COLUMBIA 20024 |
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SUGHRUE, MION, ZINN, MACPEAK & SEAS |
2100 PENNSYLVANIA AVENUE, N.W. |
WASHINGTON, DC 20037 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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6560 ROCK SPRING DRIVE |
BETHESDA, MARYLAND 20817 |
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J. FRANK OSHA |
SUGHRUE MION ZINN MACPEAK & SEAS |
2100 PENNSYLVANIA AVENUE, N.W., STE. 800 |
WASHINGTON, D.C. 20037-3202 |
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Assignment:
3
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GRANT OF SECURITY INTEREST
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60 WALL STREET |
NEW YORK, NEW YORK 10005 |
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WHITE & CASE LLP |
JOHN M. GENOVA |
PATENT DEPARTMENT |
1155 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10036 |
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Assignment:
4
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11 MADISON AVENUE |
NEW YORK, NEW YORK 10010 |
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CORPORATION SERVICE COMPANY |
1090 VERMONT AVENUE NW, SUITE 430 |
ATTN: JEAN PATERSON |
WASHINGTON, DC 20005 |
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