Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/1991
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Application #:
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07415844
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Filing Dt:
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10/02/1989
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Inventor:
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ROBERT A. NEWMAN
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Title:
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GROUND PLANE FOR PLASTIC ENCAPSULATED INTEGRATED CIRCUIT DIE PACKAGES AND METHOD OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| JOHN P. TAYLOR |
| 658 NEW DORSET COURT |
| SAN JOSE, CA 95136 |
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