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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/24/1991
Application #:
07612628
Filing Dt:
11/14/1990
Inventors:
YASUTSUGU TSUTSUMI, SUEYOSHI TANAKA
Title:
MOLD FOR RESIN-SEALING A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
005585/0283Recorded: 01/25/1991Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
01/12/1991
Exec Dt:
01/12/1991
Assignee:
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
LEYDIG, VOIT & MAYER
700 13TH ST., NW, STE. 300
WASHNGTON, DC 20005

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