Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/25/1992
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Application #:
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07557427
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Filing Dt:
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07/23/1990
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Inventor:
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DAVID H. CAREY
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Title:
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TRENCHING TECHNIQUES FOR FORMING VIAS AND CHANNELS IN MULTILAYER ELECTRICAL INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| DAVID SIGMOND |
| MICROELECTRONICS & COMPUTER TECHNOLOGY |
| 3500 WEST BALCONES CENTER DRIVE |
| AUSTIN, TX 78759-6509 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 250 2-KA TAEPYUNG-RO |
| CHUNG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| VOLENTINE FRANCOS, P.L.L.C. |
| ANDREW J. TELESZ, JR. |
| 12200 SUNRISE VALLEY DRIVE |
| SUITE 150 |
| RESTON, VA 20191 |
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