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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/10/1992
Application #:
07595310
Filing Dt:
10/10/1990
Inventors:
TAKAYASU KIZAKI, CHONG-IL PARK, REIICHI YAMADA
Title:
CERAMIC CHIP-RESISTANT CHAMFERED INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
005537/0725Recorded: 12/10/1990Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
11/28/1990
Exec Dt:
11/29/1990
Exec Dt:
11/29/1990
Assignee:
8611 BALBOA AVENUE
SAN DIEGO, CALIFORNIA 92123
Correspondent:
SPENSLEY HORN JUBAS & LUBITZ
1880 CENTURY PARK EAST, STE. 500
LOS ANGELES, CA 90067

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