Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/1992
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Application #:
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07688108
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Filing Dt:
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04/19/1991
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Inventor:
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HIROMASA HASHIMOTO
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Title:
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FOAM BACKING PAD FOR USE WITH SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 4-2, MARUNOUCHI 1 CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| RONALD R. SNIDER |
| TOWNSEND AND SNIDER |
| SUITE 500 |
| 1225 EYE STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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