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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/05/1992
Application #:
07353256
Filing Dt:
05/16/1989
Inventors:
SHOZO NAKAMURA, AIZO KANEDA, SHIGEHARU TSUNODA, AKIO HASEBE, MASAO MITANI
Title:
METHOD FOR ENCAPSULATING SEMICONDUCTOR CHIPS
Assignment: 1
Reel/Frame:
005089/0233Recorded: 05/16/1989Pages: 1
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
04/28/1989
Exec Dt:
04/28/1989
Exec Dt:
04/28/1989
Exec Dt:
04/28/1989
Exec Dt:
04/28/1989
Assignee:
LTD., 6, KANDA SURUGADAI 4-CHOME
CHIYODA-KU
TOKYO, JAPAN
Correspondent:
PATRICK R. ROCHE
1100 SUPERIOR AVENUE - SUITE 700
CLEVELAND, OHIO 44114-2518
Assignment: 2
Reel/Frame:
019881/0292Recorded: 09/26/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/29/2007
Assignee:
4-1, MARUNOUCHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY, STANGER, MALUR & ET AL
1800 DIAGONAL ROAD
SUITE 370
ALEXANDRIA, VA 22314

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