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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	5130779	Issue Dt:	07/14/1992	Application #:	07540256	Filing Dt:	06/19/1990
Inventors:	BIRENDRA N. AGARWALA, AZIZ M. AHSAN, ARTHUR BROSS, MARK F. CHADURJIAN et al
Title:	SOLDER MASS HAVING CONDUCTIVE ENCAPSULATING ARRANGEMENT

Assignment: 1

Reel/Frame:

005361/0053

Recorded: 06/19/1990

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST.

Assignors:

AGARWALA, BIRENDRA N.

Exec Dt:

06/06/1990

AHSAN, AZIZ M.

Exec Dt:

06/04/1990

BROSS, ARTHUR

Exec Dt:

06/06/1990

CHADURJIAN, MARK F.

Exec Dt:

05/11/1990

KOOPMAN, NICHOLAS G.

Exec Dt:

05/01/1990

LEE, LI-CHUNG

Exec Dt:

05/30/1990

PUTTLITZ, KARL J.

Exec Dt:

06/13/1990

RAY, SUDIPTA K.

Exec Dt:

06/05/1990

RYAN, JAMES G.

Exec Dt:

05/11/1990

SCHAEFER, JOSEPH G.

Exec Dt:

05/21/1990

SRIVASTAVA, KAMALESH K.

Exec Dt:

06/04/1990

TOTTA, PAUL A.

Exec Dt:

06/12/1990

WALTON, ERICK G.

Exec Dt:

05/11/1990

WIRSING, ADOLF E.

Exec Dt:

05/11/1990

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, A CORP. OF NY.

ARMONK, NEW YORK 10504

Correspondent:

IRA D. BLECKER

IBM CORP.,

INTELLECTUAL PROP. LAW., D/901

ROUTE 52, B/300-482

HOPEWELL JUNCTION, NY 12533-9988

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