Patent Assignment Abstract of Title
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Total Assignments:
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Patent #:
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Issue Dt:
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11/03/1992
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Application #:
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07532722
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Filing Dt:
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06/04/1990
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Inventors:
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RICHARD CHAO-FAN CHU, MICHAEL J. ELLSWORTH JR., GARY F. GOTH, ROBERT E. SIMONS et al
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Title:
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ENHANCED MULTICHIP MODULE COOLING WITH THERMALLY OPTIMIZED PISTONS AND CLOSELY COUPLED CONVECTIVE COOLING CHANNELS, AND METHODS OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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RICHARD M. LUDWIN |
IBM CORP., DEPT. 447/BLDG. 414 |
P. O. BOX 950 |
POUGHKEEPSIE, NY 12602 |
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