Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/15/1992
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Application #:
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07638888
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Filing Dt:
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01/08/1991
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Inventors:
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PATRICK W. DE HAVEN, J. DANIEL MIS, KENNETH P. RODBELL, PAUL A. TOTTA, JAMES F. WHITE
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Title:
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MULTILAYERED INTERMETALLIC CONNECTION FOR SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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JEFFREY L. BRANDT |
IBM CORPORATION, DEPT. 18G/BLDG. 300-482 |
ROUTE 52 |
HOPEWELL JUNCTION, NY 12533-9988 |
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