Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/04/1993
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Application #:
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07822330
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Filing Dt:
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01/15/1992
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Inventor:
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ROBERT A. NEWMAN
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Title:
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PROCESS FOR MAKING A MULTILAYER LEAD FRAME ASSEMBLY FOR AN INTEGRATED CIRCUIT STRUCTURE AND MULTILAYER INTEGRATED CIRCUIT DIE PACKAGE FORMED BY SUCH PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| P.O. BOX 3453 |
| 901 THOMPSON PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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| JOHN P. TAYLOR |
| 658 NEW DORSET COURT |
| SAN JOSE, CA 95136-2932 |
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