Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/1993
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Application #:
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07776787
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Filing Dt:
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10/16/1991
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Inventors:
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TATSUO ENOMOTO, MICHITO SATO, SHIGEYOSHI NEZU
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Title:
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WAFER ETCHING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| STEPHEN A. BECKER |
| LOWE, PRICE, LEBLANC ET AL |
| 99 CANAL CENTER PLAZA |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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