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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/22/1993
Application #:
07748114
Filing Dt:
08/21/1991
Inventors:
GARY W. BLANCHARD, CHARLES R. BOSSI, EDWARD H. PAYNE, THOMAS W. WEEKS
Title:
METHOD FOR REDUCING FOREIGN MATTER ON A WAFER ETCHED IN A REACTIVE ION ETCHING PROCESS
Assignment: 1
Reel/Frame:
005820/0498Recorded: 08/21/1991Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
08/20/1991
Exec Dt:
08/20/1991
Exec Dt:
08/20/1991
Exec Dt:
08/20/1991
Assignee:
ARMONK, NEW YORK 10504
Correspondent:
NICHOLAS MESITI
HESLIN & ROTHENBERG
450 NEW KARNER RD.
P.O. BOX 12695
ALBANY, NY 12212-2695

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