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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/10/1993
Application #:
07836643
Filing Dt:
02/14/1992
Inventors:
THOMAS A. KNECHT, BRIAN M. MANCINI, JOSEPH P. KRAUSE
Title:
SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION
Assignment: 1
Reel/Frame:
006023/0106Recorded: 02/14/1992Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
02/14/1992
Exec Dt:
02/14/1992
Exec Dt:
02/14/1992
Assignee:
A CORPORATION OF DELAWARE
SCHAUMBURG, ILLINOIS
Correspondent:
STEVEN G. PARMELEE
MOTOROLA, INC.
CORPORATE OFFICES
1303 EAST ALGONQUIN ROAD
SCHAUMBURG, IL 60196
Assignment: 2
Reel/Frame:
010052/0293Recorded: 06/24/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/10/1999
Assignee:
905 WEST BOULEVARD NORTH
ELKHART, INDIANA 46514
Correspondent:
JONES, DAY, REAVIS & POGUE
RONALD A. SANDLER
77 W. WACKER DRIVE
CHICAGO, IL 60601-1692

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