Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/1993
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Application #:
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07754754
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Filing Dt:
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09/04/1991
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Inventor:
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NOBUYOSHI OGINO
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Title:
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METHOD OF PRODUCING A BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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| TOWNSEND & SNIDER |
| SUITE 500 |
| 1225 EYE STREET, N. W. |
| WASHINGTON, DC 20007 |
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